1/8 www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. stepping motor driver series standard 36v stepping motor drivers BD63940EFV, bd63960efv description BD63940EFV,bd63960efv are the ultra simp le type that provides the minimum function for driving stepping motor and various protection circuits. as for its basic function, it is a low power consumption bipolar pwm constant cu rrent-drive driver with power supply?s rated voltage of 36v and rated output curr ent of 1.2a, 1.5a, and each driver is pin- compatible so that replacement can be done easily. also it makes -step drive possible by inputting external dac si gnal so that it prov ides wider application area. there are excitation modes of full step & half step mode. this series contribut es to reduction of mounting area, cost down, safety design. feature 1) power supply: one system drive (rated voltage of 36v) 2) rated output current: 1.2a, 1.5a 3) low on resistance dmos output 4) parallel in drive mode 5) 2ch drive dc motor 6) pwm constant current control (self oscillation) 7) built-in spike noise cancel function (external noise filter is unnecessary) 8) full step applicable to half step 9) applicable to step drive 10) forward/reverse break mode for dc motor 11) power save function 12) built-in logic input pull-down resistor 13) power-on reset function 14) thermal shutdown circuit (tsd) 15) over current protection circuit (ocp) 16) under voltage lock out circuit (uvlo) 17) over voltage lock out circuit (ovlo) 18) malfunction prevention at the time of no app lied power supply (ghost supply prevention) 19) electrostatic discharge: 4kv (hbm specification) 20) microminiature, ultra-thin and high heat-radiation (exposed metal type) htssop package 21) pin-compatible line-up application laser beam printer, scanner, photo printer, fax, ink jet prin ter, mini printer, sewing machine, toy, and robot etc. no.12009eat11
technical note 2/8 BD63940EFV, bd63960efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. absolute maximum ratings(ta=25 ) item symbol BD63940EFV bd63960efv unit supply voltage v cc1,2 -0.2 +36.0 v power dissipation pd 1.1 1 w 4.0 2 input voltage for control pin v in -0.2 +5.5 v rnf maximum voltage v rnf 0.5 v maximum output current i out 1.2 3 1.5 3 a/phase operating temperature range t opr -25 +85 storage temperature range t stg -55 +150 junction temperature t jmax +150 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 8.8mw/ for operating above ta=25 . 2 4-layer recommended board. derating in done at 32.0mw/ for operating above ta=25 . 3 do not, however exceed pd, aso and tjmax=150 . operating conditions(ta= -25 +85 ) item symbol BD63940EFV bd63960efv unit supply voltage v cc1,2 19 28 v output current (dc) i out 0.9 4 1.2 4 a/phase 4 do not however exceed pd, aso. electrical characteristics applicable to all the series (unless otherwise specified ta=25 , v cc1,2 =24v) item symbol limit unit condition min. typ. max. whole circuit current at standby i ccst - 0.6 2.0 ma ps=l circuit current i cc - 2.7 7.0 ma ps=h, vref=0.4v control input (in1a, in1b, in2a, in2b, ps) h level input voltage v inh 2.0 - - v l level input voltage v inl - - 0.8 v output (out1a, out1b, out2a, out2b) output on resistance (BD63940EFV) r on - 1.4 1.8 i out =0.7a sum of upper and lower output on resistance (bd63960efv) r on - 1.1 1.4 i out =1.0a sum of upper and lower output leak current i leak - - 10 a current control rnfx input current i rnfx -40 -20 - a rnfx=0v vrefx input current i vref -2.0 -0.1 - a vrefx=0v vrefx input voltage range v ref 0 - 0.4 v comparator offset v cofs -20 0 20 mv vrefx=0.4v minimum on time t onmin 0.3 0.7 1.2 s r=39k , c=1000pf
technical note 3/8 BD63940EFV, bd63960efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. terminal function 1) BD63940EFV/bd63960efv pin no. pin name function pin no. pin name function 1 pgnd ground terminal 13 in1a logic input terminal 2 in2b logic input terminal 14 pgnd ground terminal 3 vref2 output current value setting terminal 15 vcc1 power supply terminal 4 cr2 connection terminal of cr for setting pwm frequency 16 out1a h bridge output terminal 5 nc non connection 17 rnf1 connection terminal of resistor for output current detection 6 test terminal for testing (used by connecting with gnd) 18 out1b h bridge output terminal 7 gnd ground terminal 19 out2b h bridge output terminal 8 ps power save terminal 20 rnf2 connection terminal of resistor for output current detection 9 cr1 connection terminal of cr for setting pwm frequency 21 out2a h bridge output terminal 10 vref1 output current value setting terminal 22 vcc2 power supply terminal 11 in1b logic input terminal 23 nc non connection 12 nc non connection 24 in2a logic input terminal block diagram ? application circuit diagram ? input output equivalent circuit diagram fig.1 block diagram & application circuit diagram 39k 1000pf set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k 39k 1000pf set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k terminal for testing. please connect to gnd. 0.3 bypass capacitor. setting range is 100uf 470uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) resistor for current detection. setting range is 0.2 ? 0.5 (BD63940EFV) 0.2 ? 0.4 (bd63960efv) 0.3 be sure to short vcc1 & vcc2. 0.1uf 100uf vref1 cr1 10 predriver current limit comp. 15 vcc1 18 out1b one shot 16 out1a 17 rnf1 9 ocp predriver current limit comp. 22 vcc2 19 out2b 21 out2a 20 rnf2 6 test in1b in1 a 11 13 logic vref2 cr2 3 one shot 4 in2b in2 a 2 24 logic ocp 7 gnd 14 pgnd tsd ovlo uvlo 8ps regulator reset 1 pgnd resistor for current detection. setting range is 0.2 ? 0.5 (BD63940EFV) 0.2 ? 0.4 (bd63960efv)
technical note 4/8 BD63940EFV, bd63960efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. points to noti ce for terminal description ps power save terminal ps can make circuit standby state and make motor output open. please be careful because there is a delay of 40 s(max.) before it is returned from standby state to normal state and the motor output becomes active. ps state l standby state (reset) h active in1a, in1b, in2a, in2b control logic input terminal these terminals decide output state. input output ps in1a in2a in1b in2b out1a out2a out1b out2b l x x open open stand by (all circuits) h l l open open stand by h h l h l forward h l h l h reverse h h h l l brake x: h or l protection circuits thermal shutdown (tsd) this ic has a built-in thermal shutdown circuit for therma l protection. when the ic?s chip temperature rises above 175 (typ.), the motor output becomes open. also , when the temperature returns to under 150 (typ.), it automatically returns to normal operation. however, even when tsd is in operat ion, if heat is continued to be added externally, heat overdrive can lead to destruction. over current protection (ocp) this ic has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or vcc-motor output or motor output-gnd is shorted. this circ uit latches the motor output to open condition when the regulated threshold current flows for 4 s (typ.). it returns with power r eactivation or a reset of the ps terminal. the over current protection circuit?s only aim is to prevent the destruction of the ic from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. therefore, sets should not be designed to take into account this circuit?s functions. after ocp operating, if irregul ar situations continues and the return by power reactivation or a reset of the ps termi nal is carried out repeatedly, then ocp operates repeatedly and the ic may generate heat or otherwise deteriorate. when the l value of the wiring is great due to the wiring being long, after the over current has fl owed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. also, when current which is over the output current rating and under the ocp detection cu rrent flows, the ic can heat up to over t jmax =150 and can deteriorate, so current which exceeds the output rating should not be applied. under voltage lock out (uvlo) this ic has a built-in under voltage lock out function to pr event false operation such as ic output during power supply under voltage. when the applied voltage to the vcc terminal goes under 15v (typ.), the motor output is set to open. this switching voltage has a 1v (typ.) hysteresis to prev ent false operation by noise et c. please be aware that this circuit does not operate during power save mode. over voltage lock out (ovlo) this ic has a built-in over voltage lock out function to pr otect the ic output and the motor during power supply over voltage. when the applied voltage to the vcc terminal goes over 32v (typ.), the motor output is set to open. this switching voltage has a 1v (typ.) hysteresis and a 4 s (typ.) mask time to prevent false operation by noise etc. although this over voltage locked out circuit is built-in, th ere is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded, therefore the ab solute maximum value should not be exceeded. please be aware that this circuit does not operate during power save mode. false operation prevention function in no power supply (ghost supply prevention) if a logic control signal is input when there is no power suppl ied to this ic, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to the vcc, to this ic or to another ic?s power supply. therefor e, there is no malfunction of the circuit even when voltage is supplied to the logic control input terminal while there is no power supply.
technical note 5/8 BD63940EFV, bd63960efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. power dissipation htssop-b24 package (BD63940EFV/bd63960efv)) htssop-b24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. also, the back of board as well as the surfaces has large areas of c opper foil heat dissipation patterns, greatly increasing power dissipation. the back metal is shorted with the back side of the ic chip, being a gnd potential, therefore there is a possibility for malfunction if it is shorted with any potential other than gnd, which should be avoided. also, it is recommended that the back metal is solder ed onto the gnd to short. please note that it has been assumed that this product will be used in the condition of this back metal perfo rmed heat dissipation treatment for increasing heat dissipation efficiency. ambient temperature : ta[ ] 3.0 2.0 1.0 100 125 4.0w 0 4 power dissipation : pd[w] 4.0 measurement machine th156 kuwano electric measurement condition rohm board board size 70*70*1.6mm 3 (with through holes on the board) the exposed metal of the backside is connected to the board with solder. board ? 1-layer board(copper foil on the back 0mm 2 ) board ? 2-layer board(copper foil on the back 15*15mm 2 ) board ? 2-layer board(copper foil on the back 70*70mm 2 ) board ? 4-layer board(copper foil on the back 70*70mm 2 ) board ? ja = 113.6 /w board ? ja = 73.5 /w board ? ja = 44.6 /w board ? ja = 31.3 /w fig.2 htssop-b24 derating curve 2.8w 1.7w 1.1w 3 2 1
technical note 6/8 BD63940EFV, bd63960efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. usage notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and supply li nes of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) gnd potential the potential of gnd pin must be minimu m potential in all operating conditions. (5) metal on the backside (define the side w here product markings are printed as front) the metal on the backside is shorted with the backside of ic ch ip therefore it should be connec ted to gnd. be aware that there is a possibility of malfunction or destruction if it is shorted wi th any potential other than gnd. (6) thermal design use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. users should be aware that this series has been designed to expose their frames at the ba ck of the package, and should be used with suitable heat dissipation treatm ent in this area to improve dissipation. as large a dissipation pattern should be taken as possible, not only on the front of t he baseboard but also on the back surface. (7) mounting errors and inter-pin shorts when attaching to a printed circuit board, pay close attention to the direction of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destruction from short circuits which can be caused by foreign matter entering between out puts or an output and the power supply or gnd. (8) operation in a strong electric field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. (9) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (10) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (t sd circuit). if the chip temperature becomes t jmax =150 , and higher, coil output to the motor will be open. the tsd circuit is des igned only to shut the ic of f to prevent runaway thermal operation. it is not designed to protect or indemnify peri pheral equipment. do not use the tsd function to protect peripheral equipment. tsd on temperature [ ] (typ.) hysteresis temperature [ ] (typ.) 175 25 (11) inspection of the application board during inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, t herefore an electrical discharge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furthermore, when connecti ng to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection.
technical note 7/8 BD63940EFV, bd63960efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. (12) input terminal of ic this ic is a monolithic ic, and between each element there is a p+ isolation for element partition and a p substrate. this p layer and each element?s n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 3, when gnd (terminal a) at the resistance and gnd (terminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (terminal b) at the transistor (npn) the parasitic npn transistor operates with the n la yers of other elements close to the aforementioned parasitic diode. because of the ic?s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. the operation of parasitic elements causes interference in circ uit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes t he parasitic elements to operate, such as by applying voltage that is lower than the gnd (p s ubstrate) to the input terminal. fig.3 pattern diagram of parasitic element (13) ground wiring patterns when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern potential of any external components, either. (14) test terminal be sure to connect test pin to gnd. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element
technical note 8/8 BD63940EFV, bd63960efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. ordering part number b d 6 3 9 4 0 ef v -e 2 ??` efv=htssop-b24 ??`?? e2: `???`? (unit : mm) htssop-b24 0.65 1.0max 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04 0.08 m s 0.08 1.0 0.2 0.53 0.15 0.17 +0.05 - 0.03 4 + 6 ? 4 s 24 13 112 0.325 (3.4) (5.0) 7.8 0.1 7.6 0.2 5.6 0.1 (max 8.15 include burr) 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin
r1120 a www.rohm.com ? 2012 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
|
